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超微单路服务器主板 MATX/C622/6DIMM X11SPM-TPF



Product SKUs

MBD-X11SPM-TPF
  • X11SPM-TPF


Physical Stats

Form Factor
  • microATX

Dimensions
  • 9.6" x 9.6" (24.38cm x 24.38cm)


Processor/Cache

CPU
  • 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors,

  • Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 165W TDP

Cores / Cache
  • Up to 28 cores

Note
  • BIOS version 3.0a or above is required to support 2nd Generation Intel Xeon Scalable Processors-SP

  • BIOS version 3.2 or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R)


System Memory

Memory Capacity
  • Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots;

  • Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)

Memory Type
  • 2933/2666/2400/2133MHz ECC DDR4 RDIMM, LRDIMM

DIMM Sizes
  • RDIMM: 8GB, 16GB, 32GB, 64GB

  • LRDIMM: 32GB, 64GB, 128GB

  • 3DS LRDIMM: 64GB, 128GB, 256GB

Memory Voltage
  • 1.2V

Error Detection
  • Corrects single-bit errors


On-Board Devices

Chipset
  • Intel® C622

SATA
  • Intel® C622 controller for 12 SATA3 (6 Gbps) ports; RAID 0,1,5,10

IPMI
  • ASPEED AST2500

Network Controllers
  • Dual LAN with 10G SFP+ with Intel® X722 + Inphi CS4227

Graphics
  • Aspeed AST2500 BMC


Input / Output

SATA
  • 12 SATA3 (6Gbps) port

LAN
  • 2 10G SFP+ LAN ports

USB
  • 6 USB 2.0 ports (2 rear + 4 headers)

  • 5 USB 3.0 ports (2 rear + 2 headers + 1 Type A)

Video Output
  • 1 VGA port

Serial Port / Header
  • 2 COM Ports (1 rear, 1 header)

TPM
  • TPM Header

Expansion Slots

PCI-E
  • 2 PCI-E 3.0 x16,

  • 1 PCI-E 3.0 x8

M.2
  • M.2 Interface: PCI-E 3.0 x4

  • Form Factor: 2242, 2280

  • Key: M-Key

  • Double Height Connector



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